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Embedded Cooling Electronic Devices (13 results)
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Embedded Cooling of Electronic Devices
Language: English
Published by World Scientific Pub Co Inc, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Hardcover. Condition: New.
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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Language: English
Published by World Scientific Publishing Company, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
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Condition: New.
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EMBEDDED COOLING OF ELECTRONIC DEVICES
Language: English
Published by World Scientific Pub Co Inc, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Condition: As New. Unread book in perfect condition.
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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Language: English
Published by World Scientific Publishing Company, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
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EMBEDDED COOLING OF ELECTRONIC DEVICES
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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EMBEDDED COOLING OF ELECTRONIC DEVICES
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection (WSPC Series in Advanced Integration and Packaging)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 141.88
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Language: English
Published by World Scientific Publishing Co Pte Ltd, SG, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
£ 185.79
Free Shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardback. Condition: New. This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
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Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection
Language: English
Published by World Scientific Pub Co Inc, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
Hardcover. Condition: Brand New. 464 pages. 9.25x6.25x1.25 inches. In Stock.
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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection
Language: English
Published by World Scientific Publishing Co Pte Ltd, SG, 2024
ISBN 10: 9811277931 ISBN 13: 9789811277931
£ 171.20
£ 65 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardback. Condition: New. This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
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Buch. Condition: Neu. EMBEDDED COOLING OF ELECTRONIC DEVICES | Iyengar Madhusudan | Buch | Englisch | 2024 | World Scientific | EAN 9789811277931 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
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Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
