Embedded Cooling Electronic Devices (11 results)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Embedded Cooling of Electronic Devices
Iyengar, Madhusudan; Weibel, Justin A; Asheghi, Mehdi; Bar-Cohen, Avram
- Hardcover
Seller: Kuba Libri, Prague, Czech RepublicKuba Libri
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- Hardcover
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- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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- Hardcover
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection
Iyengar, Madhusudan (Editor)/ Weibel, Justin A. (Editor)/ Asheghi, Mehdi (Editor)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 464 pages. 9.25x6.25x1.25 inches. In Stock.
More images- Hardcover
- Print on Demand
Seller: preigu, Osnabrück, Germanypreigu
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Buch. Condition: Neu. EMBEDDED COOLING OF ELECTRONIC DEVICES | Iyengar Madhusudan | Buch | Englisch | 2024 | World Scientific | EAN 9789811277931 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
- Hardcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in mater…ials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
