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Electronics Packaging Forum Multichip (4 results)
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Electronics Packaging Forum: Multichip Module Technology Issues
Language: English
Published by IEEE Press, New York, NY, 1994
ISBN 10: 078030439X ISBN 13: 9780780304390
Seller: Book Bear, West Brookfield, MA, U.S.A.
Association Member: SNEAB
Seller rating 5 out of 5 stars
Hardcover. Condition: Very Good. 392 pp. Tightly bound. Corners not bumped. Text is free of markings. No ownership markings. Published without dust jacket. Printed boards.
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Hardcover. Condition: New. US SELLER SHIPS FAST FROM USA.
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Electronics Packaging Forum - Multichip Module Technology Issues
Language: English
Published by IEEE Press, Piscataway, NJ, 1993
ISBN 10: 078030439X ISBN 13: 9780780304390
Seller: A & I PEDERSEN, Macclesfield, CHS, United Kingdom
Seller rating 5 out of 5 stars
First Edition
Hard Cover. First Edition. Hard pictorial covers, an as new copy, pp vii,392. Text figures and tables throughout. Size: 16x24cm.
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International EditionCondition: New. Brand New ! Fast Delivery "International Edition " and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 4-6 Working days .and we do have flat rate for up to 2LB. Extra shipping charges will be requested This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
