Electronics Packaging Forum: Multichip Modules Technology Issues - Hardcover

Hardcover

ISBN 10: 078030439X ISBN 13: 9780780304390

Publisher: I.E.E.E.Press, 1993

Synopsis

Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation copyright Book News, Inc. Portland, Or.

About this title

Synopsis

Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent d

Edition details

• Publisher: I.E.E.E.Press
• Publication date: 1993
• Language: English
• ISBN 10: 078030439X
• ISBN 13: 9780780304390
• Binding: Hardcover
• Number of pages: 410
• Editor: Morris James E.