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Avoiding Inelastic Strains Solder by Suhir Ephraim (36 results)
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Condition: As New. Unread book in perfect condition.
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Condition: New. 1st edition NO-PA16APR2015-KAP.
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Ltd, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days. 748.
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Paperback. Condition: Brand New. 406 pages. 9.18x6.12x9.21 inches. In Stock.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by CRC Press 2020-11-26, 2020
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
Hardcover. Condition: New.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Group, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
Condition: New.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Group, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
Condition: New.
-
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Condition: As New. Unread book in perfect condition.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Group, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
Condition: New.
-
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Ltd, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. New copy - Usually dispatched within 4 working days. 908.
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Hardcover. Condition: Brand New. 382 pages. 9.75x6.50x1.00 inches. In Stock.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback)
Published by Taylor & Francis Ltd, London, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Paperback. Condition: new. Paperback. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devicesShows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical dataCovers how to design the most effective test vehicles for testing solder jointsDetails how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnectionsOutlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such casesIllustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design. The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Condition: New. PRINT ON DEMAND.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Ltd, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback)
Published by Taylor & Francis Ltd, London, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Paperback. Condition: new. Paperback. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devicesShows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical dataCovers how to design the most effective test vehicles for testing solder jointsDetails how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnectionsOutlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such casesIllustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design. The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
-
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback)
Published by Taylor & Francis Ltd, London, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Paperback. Condition: new. Paperback. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devicesShows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical dataCovers how to design the most effective test vehicles for testing solder jointsDetails how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnectionsOutlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such casesIllustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design. The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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Taschenbuch. Condition: Neu. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices | Ephraim Suhir | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2024 | CRC Press | EAN 9780367635886 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
