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Avoiding Inelastic Strains Solder by Suhir Ephraim (34 results)
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Ltd, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback)
Published by Taylor & Francis Ltd, London, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Paperback. Condition: new. Paperback. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design. The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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£ 75.16
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£ 69.50
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback)
Published by Taylor & Francis Ltd, London, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
£ 58.84
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Add to basketPaperback. Condition: new. Paperback. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design. The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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£ 80.15
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Paperback. Condition: Brand New. 406 pages. 9.18x6.12x9.21 inches. In Stock.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback)
Published by Taylor & Francis Ltd, London, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
£ 73.58
Convert currency£ 36.44 shipping from U.S.A. to United KingdomQuantity: 1 available
Add to basketPaperback. Condition: new. Paperback. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design. The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by CRC Press 2020-11-26, 2020
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Group, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Group, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Ltd, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
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Seller rating 5 out of 5 stars
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Group, 2021
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
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Hardcover. Condition: Brand New. 382 pages. 9.75x6.50x1.00 inches. In Stock.
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Paperback. Condition: Brand New. 406 pages. 9.18x6.12x9.21 inches. In Stock. This item is printed on demand.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by Taylor & Francis Ltd, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
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Add to basketGebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder j.
