Arbitrary Modeling Tsvs Integrated by Salah Khaled (20 results)
Language: English
Published by Springer, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
Language: English
Published by Springer, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
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Language: English
Published by Springer 2016-08, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
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PF. Condition: New.
Language: English
Published by Springer, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
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Condition: New. pp. 179.
Language: English
Published by Springer, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
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Condition: New. pp. 108.
Language: English
Published by Springer, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
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Taschenbuch. Condition: Neu. Arbitrary Modeling of TSVs for 3D Integrated Circuits | Khaled Salah (u. a.) | Taschenbuch | Analog Circuits and Signal Processing | ix | Englisch | 2016 | Springer | EAN 9783319374970 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann…[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer International Publishing, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby c…ontact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Language: English
Published by Springer Verlag, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. reprint edition. 192 pages. 9.25x6.10x0.46 inches. In Stock.
Language: English
Published by Springer International Publishing, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 94.30
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact…effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Language: English
Published by Springer, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer International Publishing Aug 2016, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacita…nce and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering. 192 pp. Englisch.
Language: English
Published by Springer International Publishing Sep 2014, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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£ 94.30
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and… nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering. 192 pp. Englisch.
Language: English
Published by Springer International Publishing, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region Enables readers to use a model…which is technology dependent .
Language: English
Published by Springer International Publishing, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 81.33
£ 41.92 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region Enables readers to use a model…which is technology dependent .
Language: English
Published by Springer, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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£ 120.34
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Condition: New. Print on Demand pp. 179.
Language: English
Published by Springer, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New. Print on Demand pp. 108.
Language: English
Published by Springer, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 127.19
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Condition: New. PRINT ON DEMAND pp. 179.
Language: English
Published by Springer, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. PRINT ON DEMAND pp. 108.
Language: English
Published by Springer, Springer Aug 2016, 2016
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance…and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 192 pp. Englisch.
Language: English
Published by Springer, Springer Sep 2014, 2014
Series: Book 75 of 124 - Analog Circuits and Signal Processing
- Hardcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
£ 94.30
£ 51.34 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nea…rby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 192 pp. Englisch.
