Order Total (1 Item Items):
Shipping Destination:
Arbitrary Modeling Tsvs Integrated by Salah Khaled (25 results)
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (25)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
- New (22)
- As New, Fine or Near Fine (1)
- Very Good or Good (No further results match this refinement)
- Fair or Poor (No further results match this refinement)
- As Described (2)
Binding
Collectible Attributes
- First Edition (No further results match this refinement)
- Signed (No further results match this refinement)
- Dust Jacket (No further results match this refinement)
- Seller-Supplied Images (10)
- Not Print on Demand (16)
Language (1)
Free Shipping
- Free Shipping to U.S.A. (No further results match this refinement)
Seller Location
Seller Rating
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
ix, 179p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. ACSP Analog Circuits And Signal Processing. Sprache: Englisch.
-
-
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
-
PF. Condition: New.
-
Condition: New. pp. 179.
-
Condition: New. pp. 108.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, 2016
ISBN 10: 3319374974 ISBN 13: 9783319374970
Language: English
Taschenbuch. Condition: Neu. Arbitrary Modeling of TSVs for 3D Integrated Circuits | Khaled Salah (u. a.) | Taschenbuch | ix | Englisch | 2016 | Springer International Publishing | EAN 9783319374970 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, Springer International Publishing Sep 2014, 2014
ISBN 10: 3319076108 ISBN 13: 9783319076102
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 192 pp. Englisch.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, Springer International Publishing Aug 2016, 2016
ISBN 10: 3319374974 ISBN 13: 9783319374970
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 192 pp. Englisch.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, 2016
ISBN 10: 3319374974 ISBN 13: 9783319374970
Language: English
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, 2014
ISBN 10: 3319076108 ISBN 13: 9783319076102
Language: English
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
-
Paperback. Condition: Brand New. reprint edition. 192 pages. 9.25x6.10x0.46 inches. In Stock.
-
Hardcover. Condition: Like New. Like New. book.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, 2016
ISBN 10: 3319374974 ISBN 13: 9783319374970
Language: English
Condition: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing Aug 2016, 2016
ISBN 10: 3319374974 ISBN 13: 9783319374970
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering. 192 pp. Englisch.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing Sep 2014, 2014
ISBN 10: 3319076108 ISBN 13: 9783319076102
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering. 192 pp. Englisch.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, 2016
ISBN 10: 3319374974 ISBN 13: 9783319374970
Language: English
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region Enables readers to use a model which is technology dependent .
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, 2014
ISBN 10: 3319076108 ISBN 13: 9783319076102
Language: English
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region Enables readers to use a model which is technology dependent .
-
Condition: New. Print on Demand pp. 179.
-
Condition: New. Print on Demand pp. 108.
-
Condition: New. PRINT ON DEMAND pp. 179.
-
Condition: New. PRINT ON DEMAND pp. 108.
-
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by Springer International Publishing, 2014
ISBN 10: 3319076108 ISBN 13: 9783319076102
Language: English
Buch. Condition: Neu. Arbitrary Modeling of TSVs for 3D Integrated Circuits | Khaled Salah (u. a.) | Buch | ix | Englisch | 2014 | Springer International Publishing | EAN 9783319076102 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
