Advanced Electronic Packaging (76 results)

- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
£ 17.02
£ 2.80 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

- Hardcover
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.Goodwill of Silicon Valley
Contact seller5-star sellerCondition: Used - Very good
£ 22.32
£ 2.98 shippingShips within U.S.A.Quantity: 1 available
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.

- Hardcover
Seller: Bulrushed Books, Moscow, ID, U.S.A.Bulrushed Books
Contact seller4-star sellerCondition: Used - Fair
£ 19.25
£ 6.71 shippingShips within U.S.A.Quantity: 1 available
Condition: Acceptable. SHIPS FAST. RESCUED + REPAIRED. Features a small coffee mishap, plus a reinforced binding, secured cover, and light annotations or highlighting-a durable, fully readable working copy brought back to life at a great value by our Book Sustainability Project. No access codes or CDs.

- Hardcover
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.World of Books (was SecondSale)
Contact seller5-star sellerCondition: Used - Good
£ 31.12
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc.

- Hardcover
Seller: Dream Books Co., Denver, CO, U.S.A.Dream Books Co.
Contact seller5-star sellerCondition: Used - Fair
£ 31.12
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: acceptable. This copy has clearly been enjoyedâ"expect noticeable shelf wear and some minor creases to the cover. Binding is strong, and all pages are legible. May contain previous library markings or stamps.

- Hardcover
Seller: Broad Street Books, Branchville, NJ, U.S.A.Broad Street Books
Contact seller5-star sellerCondition: Used - Very good
£ 30.77
£ 3.70 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. Book is in very nice condition, text is unmarked and pages are tight.

- Hardcover
Seller: Zephyr Books LLC, Reno, NV, U.S.A.Zephyr Books LLC
Contact seller5-star sellerCondition: Used - Very good
£ 29.65
£ 4.82 shippingShips within U.S.A.Quantity: 1 available
Condition: Very Good. Heavy book, requires extra postage. A very good plus copy, no dustjacket. 8vo. xxxii, 789 pp. Hardcover, glossy pictorial boards.

- Hardcover
Seller: Better World Books, Mishawaka, IN, U.S.A.Better World Books
Contact seller5-star sellerCondition: Used - Very good
£ 36.23
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Very Good. 2 Edition. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Advanced Mems Packaging (electronic Engineering)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
£ 89.07
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
£ 89.07
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: WSPC Series in Advanced Integration and Packaging, Book 4 of 7. Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
£ 99.97
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: WSPC Series in Advanced Integration and Packaging, Book 4 of 7. Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
£ 99.97
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Language: English
Published by CRC Press, 1995
Series: Electronic Packaging, Book 1 of 1. Book 1 of 1 - Electronic Packaging
- Hardcover
Seller: SHIMEDIA, Brooklyn, NY, U.S.A.SHIMEDIA
Contact seller5-star sellerCondition: New
£ 100.10
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. Satisfaction Guaranteed or your money back.

- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
£ 104.54
£ 5.20 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

Language: English
Published by World Scientific Publishing Company, Incorporated, 2012
Series: WSPC Series in Advanced Integration and Packaging, Book 1 of 7. Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: Used
£ 111.65
£ 2.98 shippingShips within U.S.A.Quantity: 1 available
Condition: Used. pp. 440.

Language: English
Published by World Scientific Publishing Company, Incorporated, 2012
Series: WSPC Series in Advanced Integration and Packaging, Book 1 of 7. Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: Used
£ 114.11
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Used. pp. 440.

Language: English
Published by World Scientific Publishing Company, Incorporated, 2012
Series: WSPC Series in Advanced Integration and Packaging, Book 1 of 7. Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: Used
£ 117.48
£ 8.49 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Used. pp. 440.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: WSPC Series in Advanced Integration and Packaging, Book 4 of 7. Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
£ 138.81
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

- Softcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
Contact seller5-star sellerCondition: New
£ 130.46
£ 13.46 shippingShips from China to U.S.A.Quantity: 1 available
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. includ…ing important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: WSPC Series in Advanced Integration and Packaging, Book 4 of 7. Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: Used
£ 144.72
£ 2.98 shippingShips within U.S.A.Quantity: 1 available
Condition: Used. pp. 550 Second edition NO-PA16APR2015-KAP.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: WSPC Series in Advanced Integration and Packaging, Book 4 of 7. Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: Used
£ 148.83
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Used. pp. 550.

- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
£ 144.43
£ 9.36 shippingShips from United Kingdom to U.S.A.Quantity: 15 available
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.

- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 142.97
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.

- Hardcover
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
£ 148.91
£ 11.52 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new.

Language: English
Published by Springer, 2013
Series: Springer Series in Advanced Microelectronics, Book 28 of 72. Book 28 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 148.08
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.

Language: English
Published by World Scientific Pub Co Inc, 2017
Series: WSPC Series in Advanced Integration and Packaging, Book 4 of 7. Book 4 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: Used
£ 156.04
£ 8.49 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Used. pp. 550.

Language: English
Published by World Scientific Pub Co Inc, 2012
Series: WSPC Series in Advanced Integration and Packaging, Book 1 of 7. Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 148.09
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.

Language: English
Published by Springer International Publishing AG, Cham, 2025
- Hardcover
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
Contact seller5-star sellerCondition: New
£ 176.70
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packa…ging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Language: English
Published by World Scientific Publishing Company, 2012
Series: WSPC Series in Advanced Integration and Packaging, Book 1 of 7. Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 148.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 197.19
£ 2.98 shippingShips within U.S.A.Quantity: 4 available
Condition: New.