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Advanced Electronic Packaging (82 results)
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hardcover. Condition: Good. Ex-library book with typical stickers and stampings. NO Priority Mail is available on this item. No international shipping.
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Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.
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Condition: Acceptable. SHIPS FAST. RESCUED + REPAIRED. Features a small coffee mishap, plus a reinforced binding, secured cover, and light annotations or highlighting-a durable, fully readable working copy brought back to life at a great value by our Book Sustainability Project. No access codes or CDs.
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Hardcover. Condition: Very Good. Book is in very nice condition, text is unmarked and pages are tight.
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Advanced Electronic Packaging: With Emphasis on Multichip Modules
Language: English
Published by IEEE Press., New York., 1999
ISBN 10: 0780347005 ISBN 13: 9780780347007
Seller: Zephyr Books LLC, Reno, NV, U.S.A.
Association Member: ABAA ILAB IOBA
Seller rating 5 out of 5 stars
Condition: Very Good. Heavy book, requires extra postage. A very good plus copy, no dustjacket. 8vo. xxxii, 789 pp. Hardcover, glossy pictorial boards.
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Advanced Electronic Packaging (IEEE Press Series on Microelectronic Systems)
Language: English
Published by Wiley-IEEE Press (edition 2), 2006
ISBN 10: 0471466093 ISBN 13: 9780471466093
Hardcover. Condition: Very Good. 2. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.
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Advanced Electronic Packaging (IEEE Press Series on Microelectronic Systems)
Language: English
Published by Wiley-IEEE Press (edition 2), 2006
ISBN 10: 0471466093 ISBN 13: 9780471466093
Hardcover. Condition: Very Good. 2. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.
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Condition: acceptable. This copy has clearly been enjoyedâ"expect noticeable shelf wear and some minor creases to the cover. Binding is strong, and all pages are legible. May contain previous library markings or stamps.
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Advanced Electronic Packaging
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc.
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Advanced Electronic Packaging (IEEE Press Series on Microelectronic Systems)
Seller: Bay State Book Company, North Smithfield, RI, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good.
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Advanced Electronic Packaging
Language: English
Published by Wiley & Sons, Incorporated, John, 2006
ISBN 10: 0471466093 ISBN 13: 9780471466093
Condition: Very Good. 2 Edition. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Advanced Routing of Electronic Modules (Electronic Packaging)
Seller: Bay State Book Company, North Smithfield, RI, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good.
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COST ANALYSIS OF ELECTRONIC SYSTEMS (SECOND EDITION) (WSPC Series in Advanced Integration and Packaging, 4)
Book 4 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
hardcover. Condition: As New. 2nd. World Scientific, 2017. Hard cover, 2nd edition. Fine condition with no dust jacket, as issued.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. Satisfaction Guaranteed or your money back.
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Cost Analysis of Electronic Systems WSPC Series in Advanced Integration and Packaging: Volume 4
Book 4 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Cost Analysis of Electronic Systems WSPC Series in Advanced Integration and Packaging: Volume 4
Book 4 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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COST ANALYSIS OF ELECTRONIC SYSTEMS (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING): 1
Book 1 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Publishing Company, Incorporated, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
Condition: Used. pp. 440.
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COST ANALYSIS OF ELECTRONIC SYSTEMS (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING): 1
Book 1 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Publishing Company, Incorporated, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
Condition: Used. pp. 440.
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COST ANALYSIS OF ELECTRONIC SYSTEMS (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING): 1
Book 1 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Publishing Company, Incorporated, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
Condition: Used. pp. 440.
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COST ANALYSIS OF ELECTRONIC SYSTEMS - WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING 4
Book 4 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Cost Analysis Of Electronic Systems: Second Edition: 4 (Wspc Series In Advanced Integration And Packaging)
Book 4 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Condition: New. pp. 550 Second edition NO-PA16APR2015-KAP.
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Advanced electronic packaging technology(Chinese Edition)
Language: English
Published by Chemical Industry Press, 2024
ISBN 10: 7122458822 ISBN 13: 9787122458827
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi.
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Cost Analysis Of Electronic Systems: Second Edition: 4 (Wspc Series In Advanced Integration And Packaging)
Book 4 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Condition: New. pp. 550.
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Cost Analysis Of Electronic Systems: Second Edition: 4 (Wspc Series In Advanced Integration And Packaging)
Book 4 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Condition: New. pp. 550.
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Advanced Electronic Packaging
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 4 out of 5 stars
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
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Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection (WSPC Series in Advanced Integration and Packaging)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 142.97
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: new.
