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Electronic Packaging (115 results)
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Hardcover. Condition: Fair. No Jacket. 1st Edition. This book is seriously flawed by the fact that pages 289 to 307 function as an insert. They are completely separated from the binding. But the book is all there and is otherwise in new condition. There are no tears or signs of wear to the clean pages or the cover.
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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series)
Book 2 of 4: Electronic PackagingSeller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: acceptable. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Acceptable condition! Any other included accessories are also in Acceptable condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear such as cover tears discoloration, staining, marks, scuffs, etc. All pages intact.
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Hardcover. Condition: Very Good. Dust Jacket Condition: No Dust Jacket. 1st Edition. Name of previous owner in ink inside front board. Otherwise copy is clean and unmarked in very good condition. 214 pages.
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Guidebook for Managing Silicon Chip Reliability. (=Electronic Packaging Series).
Book 2 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Inc., 1998
ISBN 10: 0849396247 ISBN 13: 9780849396243
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germany
Association Member: GIAQ
Seller rating 5 out of 5 stars
Hardcover. Condition: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.
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Hardcover. Condition: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority!
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Condition: As New. Unread book in perfect condition.
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Condition: As New. Unread book in perfect condition.
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Condition: New. pp. 224.
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Condition: New. Satisfaction Guaranteed or your money back.
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Condition: New. pp. 224.
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Condition: New. 1st edition NO-PA16APR2015-KAP.
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Guidebook for Managing Silicon Chip Reliability
Book 2 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach
Book 4 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
Book 4 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Ltd, 2020
ISBN 10: 0367400979 ISBN 13: 9780367400972
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
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Guidebook for Managing Silicon Chip Reliability
Book 2 of 4: Electronic PackagingLanguage: English
Published by Taylor & Francis Ltd, 2019
ISBN 10: 0367400065 ISBN 13: 9780367400064
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
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Electronic Packaging Materials and Their Properties
Book 3 of 4: Electronic PackagingSeller: Better World Books Ltd, Dunfermline, United Kingdom
Seller rating 5 out of 5 stars
First Edition
Condition: Very Good. 1st Edition. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach
Book 4 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Condition: New. pp. 224.
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hardcover. Condition: Very Good. Unmarked Pages. Solid Binding.
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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging)
Book 2 of 4: Electronic PackagingSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 53.10
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Influence of Temperature on Microelectronics and System Reliability
Book 4 of 4: Electronic PackagingSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 53.10
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Guidebook for Managing Silicon Chip Reliability
Book 2 of 4: Electronic PackagingSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
![Seller image for Electronic Packaging Materials and Their Properties [Hardcover] Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus and Mahajan, Rahul for sale by River Books](https://pictures.abebooks.com/inventory/md/md32439002458.jpg)