Isbn: 9787561282113 - Chip Packaging and Testing(chinese Edition) (1 results)

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  • Language: English

    Published by Northwestern Polytechnical University Press, 2022

    7561282117 / 9787561282113

    • Softcover

    Seller: liu xing, Nanjing, JS, Chinaliu xing

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    Condition: New

    £ 59.96

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    Ships from China to U.S.A.

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    paperback. Condition: New. Paperback. Pub Date: 2022-11 Pages: 130 Language: Chinese Publisher: Northwestern Polytechnical University Press Chip Packaging and Testing is a general textbook on integrated circuit chip packaging and testing. The book has 9 chapters. and the main contents include an introduction to chip packaging. microelectronics manufacturing technology. chip packaging materials. chip packaging processes. chip and circuit board assembly. advanced packaging technology. chip packaging reliability testing. .…