Items related to Chip packaging and testing(Chinese Edition)
Synopsis
Language:Chinese.paperback.Pub Date:2022-11.publisher:Northwestern Polytechnical University Press.description:Paperback. Pub Date: 2022-11 Pages: 130 Language: Chinese Publisher: Northwestern Polytechnical University Press Chip Packaging and Testing is a general textbook on integrated circuit chip packaging and testing. The book has 9 chapters. and the main
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Chip packaging and testing(Chinese Edition)
Published by
Northwestern Polytechnical University Press, 2022
ISBN 10: 7561282117
ISBN 13: 9787561282113
New
paperback
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Paperback. Pub Date: 2022-11 Pages: 130 Language: Chinese Publisher: Northwestern Polytechnical University Press Chip Packaging and Testing is a general textbook on integrated circuit chip packaging and testing. The book has 9 chapters. and the main contents include an introduction to chip packaging. microelectronics manufacturing technology. chip packaging materials. chip packaging processes. chip and circuit board assembly. advanced packaging technology. chip packaging reliability testing. . Seller Inventory # DR008259