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9780128119785 - Encapsulation Technologies for Electronic Applications Materials and Processes for Electronic Applications by Ardebili (13 results)
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£ 180.07
Convert currency£ 6.50 shipping from United Kingdom to U.S.A.Quantity: 3 available
Add to basketCondition: New. pp. 550.
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Condition: New.
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Condition: New. pp. 550.
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£ 211.67
Convert currency£ 8.69 shipping from Germany to U.S.A.Quantity: 3 available
Add to basketCondition: New. pp. 550.
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Condition: As New. Unread book in perfect condition.
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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 219.31
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Encapsulation Technologies for Electronic Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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£ 218.50
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Encapsulation Technologies for Electronic Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 240.13
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Add to basketCondition: As New. Unread book in perfect condition.
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£ 163.85
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Add to basketCondition: new. Questo è un articolo print on demand.
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Encapsulation Technologies for Electronic Applications
Published by Elsevier Science Ltd, 2018
ISBN 10: 0128119780 ISBN 13: 9780128119785
Language: English
£ 179.29
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 2 available
Add to basketPaperback. Condition: Brand New. 2nd reprint edition. 498 pages. 8.75x6.00x1.25 inches. In Stock. This item is printed on demand.
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Encapsulation Technologies for Electronic Applications
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
£ 217.32
Convert currency£ 20.09 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Englisch.
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£ 202.62
Convert currency£ 42.80 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors .
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£ 223.06
Convert currency£ 55.99 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
