Encapsulation Technologies for Electronic Applications
Language: English
Published by William Andrew, 2018
- Softcover
- New
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
AbeBooks seller since April 6, 2009
Condition: New
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- Title
- Encapsulation Technologies for Electronic Applications
- Author
- Zhang, Jiawei; Ardebili, Haleh; Pecht, Michael; Licari, James J. (EDT)
- Publisher
- William Andrew
- Publication year
- 2018
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 0128119780
- ISBN 13
- 9780128119785
- Edition
- 2nd Edition
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.
In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.
Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
- Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics
- Includes coverage of environmentally friendly 'green encapsulants'
- Presents coverage of faults and defects, and how to analyze and avoid them
"Synopsis" may belong to another edition of this title.
About the Author
Jiawei Zhang has 10 years of experience working in the development and implementation of advanced packages. He is currently Staff Engineer at Qualcomm, San Diego. Previously, he served as Development Senior Staff Engineer at Broadcom Corporation responsible for IC package co-design flow (Die/Package/System). He is experienced in advanced package, FCBGA, MCM, and SiP. He has published over 30 external papers, including two which won best Conference Paper Awards (2012 IMAPS and 2014 SMTAI) He has been honored with one Broadcom Corporation Outstanding Technical Achievement Awards for design flow. He also served on the IWLPC Technical Committee from 2013 to 2015 and as the session Chair in 2013.
He is the founder and director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, an SAE Fellow, and an IMAPS Fellow. He is currently serving as editor-in-chief of Circuit World. He served as editor-in-chief of IEEE Access for 6 years, as editor-in-chief of IEEE Transactions on Reliability for 9 years, and as editor-in-chief of Microelectronics Reliability for 16 years. He has also served on three U.S. National Academy of Science studies, two U.S. Congressional investigations in automotive safety, and as an expert to the U.S. FDA. He is also a Chair Professor. He consults for 22 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems.
"About the title" may belong to another edition of this title.
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