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Wang Ran Chakrabarty Krishnendu (21 results)
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Testing of Interposer-Based 2.5D Integrated Circuits.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 12.48
Convert currency£ 25.97 shipping from Germany to U.S.A.Quantity: 3 available
Add to basketXIV, 182 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Condition: New. SUPER FAST SHIPPING.
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Condition: New.
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Condition: New. SUPER FAST SHIPPING.
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Condition: New.
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Testing of Interposer-Based 2.5D Integrated Circuits
Published by Springer International Publishing, 2017
ISBN 10: 3319547135 ISBN 13: 9783319547138
Language: English
Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
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Testing of Interposer-Based 2.5D Integrated Circuits
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 94.13
Convert currency£ 11.98 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Condition: New. pp. 182.
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Condition: New.
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Condition: New.
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Testing of Interposer-Based 2.5D Integrated Circuits
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 108.02
Convert currency£ 11.98 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
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£ 127.21
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 2 available
Add to basketHardcover. Condition: Brand New. 182 pages. 9.25x6.25x0.50 inches. In Stock.
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£ 137
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Add to basketHardcover. Condition: New. New. book.
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£ 152
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Add to basketPaperback. Condition: New. New. book.
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£ 113.68
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Add to basketCondition: New. Print on Demand pp. 182.
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£ 115.67
Convert currency£ 6.50 shipping from United Kingdom to U.S.A.Quantity: 4 available
Add to basketCondition: New. Print on Demand.
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Testing of Interposer-Based 2.5D Integrated Circuits
Published by Springer International Publishing, 2017
ISBN 10: 3319547135 ISBN 13: 9783319547138
Language: English
£ 80.23
Convert currency£ 42.40 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a single-source guide to the practical challenges in testing of 2.5D ICsPresents an efficient method to locate defects in a passive interposer before stackingDescribes an efficient interconnect-test solution to target through-silicon vias (.
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£ 120.68
Convert currency£ 8.61 shipping from Germany to U.S.A.Quantity: 4 available
Add to basketCondition: New. PRINT ON DEMAND pp. 182.
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Testing of Interposer-Based 2.5D Integrated Circuits
Published by Springer International Publishing, 2018
ISBN 10: 3319854615 ISBN 13: 9783319854618
Language: English
£ 87.85
Convert currency£ 42.40 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a single-source guide to the practical challenges in testing of 2.5D ICsPresents an efficient method to locate defects in a passive interposer before stackingDescribes an efficient interconnect-test solution to target through-silicon vias (.
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£ 122.74
Convert currency£ 8.61 shipping from Germany to U.S.A.Quantity: 4 available
Add to basketCondition: New. PRINT ON DEMAND.
