Premachandran C (11 results)
- Hardcover
- First Edition
Seller: BOOKWEST, Phoenix, AZ, U.S.A.BOOKWEST
Contact seller3-star sellerCondition: Used - Very good
£ 30.79
£ 3.73 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. 1st Edition. SHIPS FROM USA TO LOCATIONS WITHIN USA. NO HIGHLIGHTING: UNUSED BOOK HAS A REMAINDER MARK AT ITS EDGE: SHIPS FROM USA TO LOCATIONS WITHIN USA.
- Hardcover
Seller: The Book Spot, Sioux Falls, MN, U.S.A.The Book Spot
Contact seller4-star sellerCondition: New
£ 64.67
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: New.
Advanced Mems Packaging (electronic Engineering)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
£ 89.04
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: Used
£ 124.41
£ 2.98 shippingShips within U.S.A.Quantity: 1 available
Condition: Used. pp. xxiii + 552.
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: Used
£ 127.04
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Used. pp. xxiii + 552 Illus.
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
£ 141.36
Free ShippingShips within U.S.A.Quantity: 2 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: Used
£ 133.34
£ 8.48 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Used. pp. xxiii + 552.
- Hardcover
Seller: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
Contact seller4-star sellerCondition: New
£ 147.85
Free ShippingShips within U.S.A.Quantity: 2 available
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Published by MCGRAW HILL BOOK CO, 2009
- Hardcover
Seller: Studibuch, Stuttgart, GermanyStudibuch
Contact seller5-star sellerCondition: Used - Good
£ 6.14
£ 53.10 shippingShips from Germany to U.S.A.Quantity: 1 available
hardcover. Condition: Befriedigend. 552 Seiten; 9783527325283.4 Gewicht in Gramm: 1.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 143.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 183.04
£ 55.12 shippingShips from Germany to U.S.A.Quantity: 1 available
Gebundene Ausgabe. Condition: Neu. Neu neuware, importqualität, auf lager - A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packa…ging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging.
