Softcover. Condition: Bon. Ancien livre de bibliothèque avec équipements. Edition 2006. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Good. Former library book. Edition 2006. Ammareal gives back up to 15% of this item's net price to charity organizations.
Softcover. Condition: Très bon. Ancien livre de bibliothèque avec équipements. Edition 2006. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Edition 2006. Ammareal gives back up to 15% of this item's net price to charity organizations.
Condition: very good. Gut/Very good: Buch bzw. Schutzumschlag mit wenigen Gebrauchsspuren an Einband, Schutzumschlag oder Seiten. / Describes a book or dust jacket that does show some signs of wear on either the binding, dust jacket or pages.
Condition: Neuf.
Language: English
Published by Kluwer Academic Publishers, Boston, 1994
ISBN 10: 0792394410 ISBN 13: 9780792394419
Seller: PsychoBabel & Skoob Books, Didcot, United Kingdom
Hardcover. Condition: Good. Dust Jacket Condition: No Dust Jacket. Hardcover without jacket. Minor dents on rear upper edge; leading corners are very slightly bent and worn. Spine head a little bumped. A few superficial scores elsewhere on boards. Previous owner's name inked on FEP. Small stain on rear pastedown, imprinted onto BEP. Pages remain sound and clean; text and diagrams clear throughout. Reprinted from a Special Issue of 'Analog Integrated Circuits and Signal Processing: An International Journal', Vol. 5, No. 1 (1994). TS. Used.
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: New.
Condition: New.
Seller: Poverty Hill Books, Mt. Prospect, IL, U.S.A.
Hardcover. Condition: New. HARDCOVER, BRAND NEW COPY, Perfect Shape, No Black Remainder Mark, 517-709Fast Shipping With Online Tracking, International Orders shipped Global Priority Air Mail, All orders handled with care and shipped promptly in secure packaging, we ship Mon-Sat and send shipment confirmation emails. Our customer service is friendly, we answer emails fast, accept returns and work hard to deliver 100% Customer Satisfaction!
Language: French
Published by Dunod, L'usine Nouvelle, 2006
ISBN 10: 2100496638 ISBN 13: 9782100496631
Seller: RECYCLIVRE, Paris, France
Condition: Bon. Merci, votre achat aide à financer des programmes de lutte contre l'illettrisme.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 96.15
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 96.15
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Add to basketCondition: New. In.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 96.15
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Add to basketCondition: New. In.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Condition: New.
Language: English
Published by Kluwer Academic Publishers, 1994
ISBN 10: 0792394410 ISBN 13: 9780792394419
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Condition: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . .
Condition: New. pp. 112.
Condition: New. pp. 220.
Condition: New. pp. 220.
hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
Taschenbuch. Condition: Neu. Modeling and Simulation of High Speed VLSI Interconnects | A Special Issue of Analog Integrated Circuits and Signal Processing An International Journal Vol. 5, No. 1 (1994) | Michel S. Nakhla (u. a.) | Taschenbuch | 108 S. | Englisch | 2012 | Springer | EAN 9781461361718 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Kluwer Academic Publishers, 1994
ISBN 10: 0792394410 ISBN 13: 9780792394419
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Books ship from the US and Ireland.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 133.99
Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
Condition: New. The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analys.
Condition: New. Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnec.
Hardcover. Condition: Like New. Like New. book.
Language: English
Published by Springer New York, Springer, 2012
ISBN 10: 1461361710 ISBN 13: 9781461361718
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: As New. Unread book in perfect condition.
Seller: Buchpark, Trebbin, Germany
Condition: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analysis. But the strained demand for high data speeds, coupled with miniaturizationon an unprecedented scale, has highlighted the previously negligible effects of interconnects; effects which are not always handled appro priately by the present levels of SPICE. Signals at these higher speeds may be degraded by long interconnect lengths compared to the increasingly shorter sig nal rise times. Interconnect structures can be diverse (pins, connectors, leads, microstrips, striplines, etc. ) and present at any of the hierarchical packaging levels: integrated circuits, printed circuit boards, multi-chip modules or sys tem backplanes. Analysis of these effects in any CAD package has become a necessity. Asymptotic waveform evaluation (AWE) and other moment matching tech niques have recently proven useful in the analysis of interconnect structures and various networks containing large linear structures with nonlinear termi nations. Previously, all that was available to the designer was a full SPICE simulation or a quick but uncertain timing estimation. Moment matching, used in linear systems analysis as a method of model reduction, describes a method to extract a small set of dominant poles from a large network. The information is obtained from the Taylor series coefficients (moments) of that system.
Paperback. Condition: Brand New. reprint edition. 106 pages. 10.20x7.60x0.40 inches. In Stock.
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer Us Jan 1994, 1994
ISBN 10: 0792394410 ISBN 13: 9780792394419
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Neuware - Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.