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C, H, N and O in Si and Characterization and Simulation of Materials and Processes. Part I and II. (European Materials Research Society Symposia Proceedings, Vol. 56).
Language: English
Published by Amsterdam (NL), Elsevier Science Ltd., 1996
ISBN 10: 0444824138 ISBN 13: 9780444824134
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germany
Association Member: GIAQ
Seller rating 5 out of 5 stars
Hardcover. Condition: Gut. 294, 256 p., with numerous figures, 29 cm, Good condition. Ex-Library with usual markings. Sprache: Englisch Gewicht in Gramm: 1960.
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Condition: As New. Unread book in perfect condition.
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Hardcover. Condition: Brand New. 1st edition. 499 pages. 9.25x6.25x0.75 inches. In Stock.
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Wafer Bonding
Book 62 of 233: Springer Series in Materials ScienceLanguage: English
Published by Springer Berlin Heidelberg, 2004
ISBN 10: 3540210490 ISBN 13: 9783540210498
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingPresents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingInclu.
