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Friedman Eby Pavlidis Vasilis (12 results)
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Three-dimensional Integrated Circuit Design (Morgan Kaufmann Series in Systems on Silicon (Hardcover)).
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
First Edition
1st ed. 19 x 24 cm. 336 pages. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Three-Dimensional Intergrated Circuit Design
Published by Elsevier, London, 2009
Seller: PsychoBabel & Skoob Books, Didcot, United Kingdom
Seller rating 5 out of 5 stars
First Edition
hardcover. Condition: Very Good. Dust Jacket Condition: No Dust Jacket. First Edition. Hard cover without jacket. Book is in very good condition; very light wear in a couple of places to edges and corners. Previous owner's name on FEP; Contents are otherwise clean, bright and tight. J. Used.
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Condition: New. pp. xv + 309.
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Condition: New. pp. xv + 309 Illus.
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Paperback. Condition: Brand New. 1st edition. 336 pages. 9.25x7.50x1.00 inches. In Stock.
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Condition: New. pp. 496.
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Condition: New. pp. xv + 309.
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Paperback. Condition: Brand New. 2nd edition. 718 pages. 9.00x7.25x2.00 inches. In Stock.
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Condition: New. pp. 496.
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Condition: New. pp. 496.
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International Mechanical Engineering Advanced Technology Renditions : 3D IC design(Chinese Edition)
Language: Chinese
Published by Machinery Industry Press, 2013
ISBN 10: 7111433513 ISBN 13: 9787111433514
paperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Pub Date :2013-09-01 Pages: 224 Publisher: Machinery Industry Press at the end of the first decade of the 21st century . based on 3D integration technology. More than Moore era quietly arrived. Have multiple active devices planes 3D IC (3DIC). is expected to provide a compact. flexible cabling . transmission speed and the number of multi- channel interconnect structures . thus providing breakthrough interconnect bottleneck for the effective IC designers means . but also to the effective integ.Four Satisfaction guaranteed,or money back.
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Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU int.
