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Hardcover. Condition: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
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The Electronics Assembly Handbook.
Seller: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Germany
Seller rating 5 out of 5 stars
gebundene Ausgabe. Condition: Gut. 603 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 1600.
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The Electronics Assembly Handbook
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 167.27
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New. pp. 628.
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The Electronics Assembly Handbook
Language: English
Published by Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
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Paperback. Condition: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock.
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: new. Questo è un articolo print on demand.
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The Electronics Assembly Handbook
Language: English
Published by Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect.
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The Electronics Assembly Handbook
Language: English
Published by Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch.
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The Electronics Assembly Handbook
Language: English
Published by Springer Berlin Heidelberg, Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch.
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Condition: New. Print on Demand pp. 628 39:B&W 8 x 10 in or 254 x 203mm Perfect Bound on White w/Gloss Lam.
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Condition: New. PRINT ON DEMAND pp. 628.
