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Edited Qinghuang Lin Todd Ryan (1 results)
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.: Volume 990
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Language: English
Paperback. Condition: Brand New. 1st edition. 358 pages. 9.02x5.98x0.75 inches. In Stock. This item is printed on demand.
