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Doane Daryl Ann (11 results)
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Condition: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships via media mail.
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paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Paperback. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Proceedings of the Tutorial Symposium on Semiconductor Technology
Published by The Electrochemical Society, Inc., Pennington, NJ, 1982
First Edition
Trade Paperback. Condition: Very Good. First. Proceedings of the Tutorial Symposium on Semiconductor Technology, May 10, 1982, Montreal, Canada.
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Multichip Module Technologies and Alternatives: The Basics
Language: English
Published by Van Nostrand Reinhold, New York, 1993
ISBN 10: 0442012365 ISBN 13: 9780442012366
Hardcover. Condition: Very Good. Pages clean & bright; binding tight; very minor wear to covers. 875 pages. Illustrated. "Emphasizing MCM fundamentals and reporting real MCM experiences, this book is intended for those who need a broad exposure to the concepts underlying the design, fabrication, packaging, assembly and manufacture of multichip modules." Size: 6" x 9".
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Multichip Module Technologies and Alternatives: The Basics
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
Condition: Like New. Used - Like New. Book is new and unread but may have minor shelf wear. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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paperback. Condition: New. In shrink wrap. Looks like an interesting title!
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Multichip Module Technologies and Alternatives: The Basics
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 184.30
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Gebunden. Condition: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.
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Hardcover. Condition: Like New. Like New. book.
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Multichip Module Technologies and Alternatives: The Basics
Language: English
Published by Springer Us Okt 1992, 1992
ISBN 10: 0442012365 ISBN 13: 9780442012366
Taschenbuch. Condition: Neu. Neuware - Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
