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Ardebili Haleh Zhang Jiawei Pecht (11 results)
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£ 179.38
Convert currency£ 6.50 shipping from United Kingdom to U.S.A.Quantity: 3 available
Add to basketCondition: New. pp. 550.
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Condition: New.
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Condition: New. pp. 550.
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Condition: New. SUPER FAST SHIPPING.
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£ 209.02
Convert currency£ 8.60 shipping from Germany to U.S.A.Quantity: 3 available
Add to basketCondition: New. pp. 550.
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Condition: As New. Unread book in perfect condition.
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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 219.31
Convert currency£ 11.98 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Encapsulation Technologies for Electronic Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 216.89
Convert currency£ 15 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Encapsulation Technologies for Electronic Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 240.11
Convert currency£ 15 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Encapsulation Technologies for Electronic Applications
Published by Elsevier Science Ltd, 2018
ISBN 10: 0128119780 ISBN 13: 9780128119785
Language: English
£ 179.29
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 2 available
Add to basketPaperback. Condition: Brand New. 2nd reprint edition. 498 pages. 8.75x6.00x1.25 inches. In Stock. This item is printed on demand.
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£ 200.47
Convert currency£ 42.34 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors .
