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£ 131.36
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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications Series)
Published by William Andrew 2009-07-22, 2009
ISBN 10: 0815515766 ISBN 13: 9780815515760
Language: English
£ 140.84
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£ 144.44
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Energy Storage : A New Approach
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Encapsulation Technologies for Electronic Applications
Published by William Andrew Publishing, 2009
ISBN 10: 0815515766 ISBN 13: 9780815515760
Language: English
Condition: New. pp. 504.
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£ 155.25
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Hardcover. Condition: Brand New. 1st edition. 504 pages. 9.25x6.25x1.25 inches. In Stock.
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Encapsulation Technologies for Electronic Applications
Published by William Andrew Publishing, 2009
ISBN 10: 0815515766 ISBN 13: 9780815515760
Language: English
£ 173.34
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Energy Storage : A New Approach
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Condition: New. pp. 550.
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£ 180.41
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Encapsulation Technologies for Electronic Applications
Published by William Andrew Publishing, 2009
ISBN 10: 0815515766 ISBN 13: 9780815515760
Language: English
£ 190.38
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£ 192.24
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Energy Storage: A New Approach
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Encapsulation Technologies for Electronic Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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£ 225.21
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Encapsulation Technologies for Electronic Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Paperback. Condition: Brand New. 498 pages. 9.00x6.00x1.13 inches. In Stock.
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£ 139.08
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£ 162.72
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Encapsulation Technologies for Electronic Applications
Published by Elsevier Science Jun 2009, 2009
ISBN 10: 0815515766 ISBN 13: 9780815515760
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
£ 156.39
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Add to basketBuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. 504 pp. Englisch.
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£ 170.16
Convert currency£ 12.14 shipping from Germany to United KingdomQuantity: 2 available
Add to basketBuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.
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Encapsulation Technologies for Electronic Applications
Published by Elsevier Science Ltd, 2018
ISBN 10: 0128119780 ISBN 13: 9780128119785
Language: English
Paperback. Condition: Brand New. 2nd reprint edition. 498 pages. 8.75x6.00x1.25 inches. In Stock. This item is printed on demand.
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£ 198.64
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Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors .
