Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Lau, John H.; Pao, Yi-Hsin

ISBN 10: 0070366489 ISBN 13: 9780070366480
Published by McGraw-Hill Professional, 1996
Language: English
Condition: Used - Very good Hardcover

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Used - Hardcover

Condition: Used - Very good

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