Moisture Sensitivity of Plastic Packages of IC Devices

Language: English

Published by Springer US, Springer US Sep 2012, 2012

1461426251 / 9781461426257

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This item is printed on demand - Print on Demand Titel. Neuware -Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 588 pp. Englisch.…

Seller Inventory # 9781461426257

Title
Moisture Sensitivity of Plastic Packages of IC Devices
Author
E. Suhir
Publisher
Springer US, Springer US Sep 2012
Publication year
2012
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
1461426251
ISBN 13
9781461426257
Item weight
879 grams
Dimensions
235x155x32 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

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AbeBooks seller since January 23, 2017

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