Moisture Sensitivity of Plastic Packages of IC Devices

Language: English

Published by Springer US Jul 2010, 2010

1441957189 / 9781441957184

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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Hardcover

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This item is printed on demand - it takes 3-4 days longer - Neuware -Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike. 588 pp. Englisch.…

Seller Inventory # 9781441957184

Title
Moisture Sensitivity of Plastic Packages of IC Devices
Author
E. Suhir
Publisher
Springer US Jul 2010
Publication year
2010
Condition
Neu
Binding
Buch
Language
English
ISBN 10
1441957189
ISBN 13
9781441957184
Item weight
1,146 grams
Dimensions
241x160x39 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

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BuchWeltWeit Ludwig Meier e.K.

Germany