Improving Reliability of Tungsten Plug Via on an Integrated Circuitry

Language: English

Published by LAP LAMBERT Academic Publishing Sep 2016, 2016

3659947482 / 9783659947483

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This item is printed on demand - Print on Demand Titel. Neuware -The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE).VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 168 pp. Englisch.…

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Bibliographic details

Title
Improving Reliability of Tungsten Plug Via on an Integrated Circuitry
Author
Apek Mulay
Publisher
LAP LAMBERT Academic Publishing Sep 2016
Publication year
2016
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3659947482
ISBN 13
9783659947483
Item weight
268 grams
Dimensions
220x150x11 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

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