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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps - Softcover
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry
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LAP LAMBERT Academic Publishing Sep 2016, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE). 168 pp. Englisch. Seller Inventory # 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry
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LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry : Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Published by
LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
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Taschenbuch
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE). Seller Inventory # 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Published by
LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
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LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry: Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
Published by
LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry | Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps
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LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
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Taschenbuch. Condition: Neu. Improving Reliability of Tungsten Plug Via on an Integrated Circuitry | Process Flow in BiCMOS and CMOS technology with Failure Analysis,Design of Experiments,Statistical Analysis & Wafer Maps | Apek Mulay | Taschenbuch | Englisch | 2016 | LAP LAMBERT Academic Publishing | EAN 9783659947483 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand. Seller Inventory # 120614586
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Improving Reliability of Tungsten Plug Via on an Integrated Circuitry
Published by
LAP LAMBERT Academic Publishing Sep 2016, 2016
ISBN 10: 3659947482
ISBN 13: 9783659947483
New
Taschenbuch
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The failure of an electronic circuitry with Aluminum metal process due to electromigration degradation has been a continuous process of research and development in semiconductor industry. With the advent of Internet of Things (IoT) revolution in global semiconductor industry, there is an expected huge demand for analog ICs for healthcare, automotive and other consumer electronic applications. Analog ICs make use of Aluminum metal process as most of the analog applications do not need a state-of-the-art technology. Aluminum is not only cost effective in use but also easy to use in processing as compared to copper. However, Aluminum metal process is prone to electromigration failures. Hence, Electronic chips that make use of Aluminum metal process have to undergo rigorous tests for reliability related failures. When wafer yield becomes low due to electromigration related failures, it results into a huge loss for the semiconductor foundries because of the capital intensive nature of this business. Hence, Semiconductor Industry Professional should be equipped with detail process steps in order to improve the process yield including statistical analysis with Design of Experiments (DoE).VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 168 pp. Englisch. Seller Inventory # 9783659947483