Heat Transfer Augmentation in a Semiconductor Device

Language: English

Published by LAP LAMBERT Academic Publishing Okt 2013, 2013

3659472808 / 9783659472800

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This item is printed on demand - Print on Demand Titel. Neuware -With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10¿C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 188 pp. Englisch.

Seller Inventory # 9783659472800

Title
Heat Transfer Augmentation in a Semiconductor Device
Author
G. S. Bhatt
Publisher
LAP LAMBERT Academic Publishing Okt 2013
Publication year
2013
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3659472808
ISBN 13
9783659472800
Item weight
298 grams
Dimensions
220x150x12 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

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