Electronic Packaging and Interconnection Handbook

Harper A.

ISBN 10: 0070266840 / ISBN 13: 9780070266841

Published by The McGraw-Hill Company, 1991

pp. 1120. Seller Inventory # 6441262

Synopsis:

This handbook is a complete, comprehensive reference to all aspects of electronic packaging, from fundamentals (Part 1) to systems (Part III). Increasingly, it is the package - not the integrated circuit - that is the limiting factor in modern, high-density, high performance electronic systems. This handbook provides in-depth coverage of this interdisciplinary field, combinating electrical, electronics, mechanical and materials principles and techniques.

Review: Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as "Handbook of Electronic Packaging," the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies..

Bibliographic Details

Title: Electronic Packaging and Interconnection ...
Publisher: The McGraw-Hill Company
Publication Date: 1991
Binding: Hardcover
Condition: Used