Electronic Materials and Processes Handbook, 2nd edition (Electronic Packaging and Interconnection Series)

Harper, Charles A., and Ronald N. Sampson, editors

ISBN 10: 0070542996 / ISBN 13: 9780070542990

Published by McGraw-Hill, 1994

About this Item

Hardcover, 2nd edition remainder; may have light scuffing to exterior as a result of warehouse storage.

Seller Inventory # 71000

Bibliographic Details

• Title: Electronic Materials and Processes Handbook, 2nd edition (Electronic Packaging and Interconnection Series)
• Publisher: McGraw-Hill
• Publication Date: 1994
• Language: English
• ISBN 10: 0070542996
• ISBN 13: 9780070542990
• Binding: Hardcover
• Condition: New

About this title

Synopsis

Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this reference contains information on plastics, elastomers, and laminates; printed wiring boards; ceramics and glasses semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.

About the Author

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.