Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this reference contains information on plastics, elastomers, and laminates; printed wiring boards; ceramics and glasses semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.
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Book Description McGraw-Hill, 1994. Hardcover. Book Condition: New. Hardcover, 2nd edition remainder; may have light scuffing to exterior as a result of warehouse storage. Bookseller Inventory # 71000
Book Description McGraw-Hill Professional Publishing, 1993. Hardcover. Book Condition: New. 2 Sub. Bookseller Inventory # DADAX0070542996
Book Description McGraw-Hill Professional Publishing, 1993. Hardcover. Book Condition: New. New item. Bookseller Inventory # QX-132-69-3235003
Book Description McGraw-Hill Professional Publishing. Hardcover. Book Condition: New. 0070542996 New Condition. Bookseller Inventory # NEW4.0024793
Book Description Book Condition: Brand New. Book Condition: Brand New. Bookseller Inventory # 97800705429901.0