Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Language: English

Published by Springer US, 2010

1441948732 / 9781441948731

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software c.

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Title
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Author
Zhang, G. Q.|Ernst, L. J.|de Saint Leger, O.
Publisher
Springer US
Publication year
2010
Condition
New
Binding
Soft cover
Language
English
ISBN 10
1441948732
ISBN 13
9781441948731

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

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