Benefiting from Thermal and Mechanical Simulation in Micro-Electronics - Softcover

 
9781441948731: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Softcover
ISBN 10: 1441948732 ISBN 13: 9781441948731
Publisher: Springer, 2010

Synopsis

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:-

  • The impact of simulation on industry profitability
  • Approaches to simulation
  • The state-of-the-art methodologies of simulation
  • Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

    • "synopsis" may belong to another edition of this title.

    Publisher
    Springer
    Publication date
    2010
    Language
    English
    ISBN 10 
    1441948732
    ISBN 13 
    9781441948731
    Binding
    Paperback
    Number of pages
    202
    Editor
    Zhang G.Q., Ernst L.J., De Saint Leger O.

    Other Popular Editions of the Same Title

    9780792372783: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

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