Advanced Interconnects for ULSI Technology
Language: English
Published by Wiley Apr 2012, 2012
- Hardcover
- New
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
AbeBooks seller since August 14, 2006
Condition: New
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Add to basketItem description from seller
Neuware - Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:\* Interconnect functions, characterisations, electrical properties and wiring requirements\* Low-k materials: fundamentals, advances and mechanical properties\* Conductive layers and barriers\* Integration and reliability including mechanical reliability, electromigration and electrical breakdown\* New approaches including 3D, optical, wireless interchip, and carbon-based interconnectsIntended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.…
Seller Inventory # 9780470662540
- Title
- Advanced Interconnects for ULSI Technology
- Author
- Ehrenfried Zschech
- Publisher
- Wiley Apr 2012
- Publication year
- 2012
- Condition
- Neu
- Binding
- Buch
- Language
- English
- ISBN 10
- 0470662549
- ISBN 13
- 9780470662540
- Item weight
- 1,069 grams
- Dimensions
- 261x177x33 mm
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
- Interconnect functions, characterisations, electrical properties and wiring requirements
- Low-k materials: fundamentals, advances and mechanical properties
- Conductive layers and barriers
- Integration and reliability including mechanical reliability, electromigration and electrical breakdown
- New approaches including 3D, optical, wireless interchip, and carbon-based interconnects
Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
"Synopsis" may belong to another edition of this title.
About the Author
IMEC, Leuven, Belgium
Paul S. Ho
Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA
Ehrenfried Zschech
Fraunhofer Institute for Nondestructive Testing, Dresden, Germany
"About the title" may belong to another edition of this title.
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