Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation.
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This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation. Various papers deal authoritatively with FEOL applications such as surface preparation for the deposition of a gate dielectric having a high dielectric constant, as well as rinsing and drying techniques. Elsewhere, the approaching major challenge of removing nano-sized particles, without causing significant substrate removal, is addressed in detail. As well as megasonic agitation, other possible particle removal techniques are also considered. The topic of metrology is addressed, because the state-of-the-art of cleaning can only progress in step with advances in metrology. The unprecedented numbers of new materials that are currently investigated, and soon introduced into pilot and manufacturing lines, are well covered in contributions on contamination control. Contributions on post-CMP cleaning and photo-resist stripping are also included. Finally, the challenge of cleaning low-k materials following etching is addressed by a large number of papers. Altogether, this collection of papers represents a timely and authoritative assessment of the state-of-the-art of this often-overlooked, but very interesting and essential, field.
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