Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Softcover

Liu, Yong

Softcover

ISBN 10: 1461410541 ISBN 13: 9781461410546

Publisher: Springer, 2012

Synopsis

Challenges of Power Electronic Packaging.- Power Package Electrical Isolation Design.- Discrete Power MOSFET Package Design and Analysis.- Power IC Packaging Design and Analysis.- Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations.- Thermal Management, Design and Cooling for Power Electronics.- Material Characterization for Power Electronics Packaging.- Power Package Typical Assembly Process.- Power Packaging Typical Reliability and Tests.- Power Packaging Modeling and Challenges.- Power Package Thermal and Mechanical Co-Design Simulation Automation.- Power Package Electrical and Multiple Physics Simulation.

Edition details

• Publisher: Springer
• Publication date: 2012
• Language: English
• ISBN 10: 1461410541
• ISBN 13: 9781461410546
• Binding: Paperback