This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:
Power Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices.
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Book Description Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. 612 pp. Englisch. Seller Inventory # 9781489987976
Book Description Condition: New. Buy with confidence! Book is in new, never-used condition. Seller Inventory # bk1489987975xvz189zvxnew
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Book Description Soft Cover. Condition: new. Seller Inventory # 9781489987976
Book Description Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting. Seller Inventory # 4212961
Book Description Condition: New. Seller Inventory # ABLIING23Mar2716030159159
Book Description Condition: New. New! This book is in the same immaculate condition as when it was published. Seller Inventory # 353-1489987975-new
Book Description Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Seller Inventory # 9781489987976
Book Description Condition: New. Seller Inventory # I-9781489987976
Book Description Paperback. Condition: Brand New. 612 pages. 9.25x6.10x1.38 inches. In Stock. Seller Inventory # x-1489987975