Items related to Design for High Performance, Low Power, and Reliable...
Synopsis
Regular vs Irregular TSV Placementfor 3D IC.- Steiner Routingfor 3D IC.- Buffer Insertion for 3D IC.- Low Power Clock Routing for 3D IC.- Power Delivery Network Design for 3D IC.- 3D Clock Routing for Pre-bond Testability.- TSV-to-TSV Coupling Analysis and Optimization.- TSV Current Crowding and Power Integrity.- Modeling of Atomic Concentration at the Wire-to-TSV Interface.- Multi-Objective Archetectural Floorplanning for 3D IC.- Thermal-aware Gate-level Placement for 3D IC.- 3D IC Cooling with Micro-Fluidic Channels.- Mechanical Reliability Analysis and Optimization for 3D IC.- Impact of Mechanical Stress on Timing Variation for 3D IC.- Chip/Package Co-Analysis of Mechanical Stress for 3D IC.- 3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations.- TSV Interfracial Crack Analysis and Optimization.- Ultra High Logic Designs Using Monolithic 3D Integration.- Impact of TSV Scaling on 3D IC Design Quality.- 3D-MAPS: 3DMassively Parallel Processor with Stacked Memory.
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