Items related to RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging - Softcover

 
9781441909855: RF and Microwave Microelectronics Packaging

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Synopsis

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.

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Other Popular Editions of the Same Title

9781441909831: RF and Microwave Microelectronics Packaging

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ISBN 10:  1441909834 ISBN 13:  9781441909831
Publisher: Springer, 2009
Hardcover