Items related to RF and Microwave Microelectronics Packaging
Synopsis
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.
"synopsis" may belong to another edition of this title.
- PublisherSpringer
- Publication date2010
- ISBN 10 1441909850
- ISBN 13 9781441909855
- BindingPaperback
- LanguageEnglish
- Number of pages304
- EditorKuang Ken, Kim Franklin, Cahill Sean S.
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