Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.
"synopsis" may belong to another edition of this title.
"Interconnect Technology and Design for Gigascale Integration" is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.
"About this title" may belong to another edition of this title.
Seller: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Germany
gebundene Ausgabe. Condition: Gut. 411 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 840. Seller Inventory # 1586129
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 1.85. Seller Inventory # G1402076061I4N00
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Condition: New. Seller Inventory # ABLIING23Mar2411530144858
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Condition: New. In. Seller Inventory # ria9781402076060_new
Quantity: Over 20 available
Seller: BennettBooksLtd, San Diego, NV, U.S.A.
hardcover. Condition: New. In shrink wrap. Looks like an interesting title! Seller Inventory # Q-1402076061
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 432. Seller Inventory # 26285931
Seller: moluna, Greven, Germany
Gebunden. Condition: New. Is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystemsIt spans IC interconnect topics ranging from IBM s revol. Seller Inventory # 458476586
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 432 Illus. Seller Inventory # 7594804
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 432. Seller Inventory # 18285921
Seller: Mispah books, Redhill, SURRE, United Kingdom
Hardcover. Condition: Like New. Like New. book. Seller Inventory # ERICA77314020760616