Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment - Hardcover
Synopsis
The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinary teaching perspective.
"synopsis" may belong to another edition of this title.
Synopsis
The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book is probably the first to address the situation from a multidisciplinary teaching perspective. The authors' expertise in Materials, Electronics Manufacture and Design are integrated throughout to establish a common platform and language for practitioners from the many fields involved. Communication is facilitated by a dual-level of presentation of the subject principles and the latest developments in industry and in research. Electronic routes for monitoring current and future progress are also provided. The book will appeal both to specialists wanting to update or increase their appreciation of related topics, and the generalist seeking relevant applications. It represents a major contribution to the field.
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Structural Integrity and Reliability in Electronics
Seller: Books Puddle, New York, NY, U.S.A.
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Structural Integrity and Reliability in Electronics
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Condition: New. pp. 360 Illus. Seller Inventory # 7560311
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Structural Integrity and Reliability in Electronics
Seller: Biblios, Frankfurt am main, HESSE, Germany
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Condition: New. pp. 360. Seller Inventory # 18320418
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Structural Integrity And Reliability In Electronics : Enhancing Performance In A Lead-free Environment
Seller: Basi6 International, Irving, TX, U.S.A.
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Structural Integrity And Reliability In Electronics : Enhancing Performance In A Lead-free Environment
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Seller Inventory # ABBB-161055
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Structural Integrity and Reliability in Electronics
Published by
Kluwer Academic Publishers, 2003
ISBN 10: 1402017650
ISBN 13: 9781402017650
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Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinary teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . . Seller Inventory # V9781402017650
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Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment
Seller: moluna, Greven, Germany
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Gebunden. Condition: New. Knowledge itself is soon obsolete It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated ab. Seller Inventory # 458473435
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Structural Integrity and Reliability in Electronics
Published by
Kluwer Academic Publishers, 2003
ISBN 10: 1402017650
ISBN 13: 9781402017650
New
Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinary teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . . Books ship from the US and Ireland. Seller Inventory # V9781402017650
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Structural Integrity and Reliability in Electronics : Enhancing Performance in a Lead-Free Environment
Seller: AHA-BUCH GmbH, Einbeck, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Neuware - Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries. Seller Inventory # 9781402017650