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Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3, 57) - Hardcover
Synopsis
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
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Electronic Packaging for High Reliability, Low Cost Electronics: Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 (NATO Science Partnership Sub-Series: 3)
Published by
Kluwer Academic Publishers, 2000
ISBN 10: 0792352181
ISBN 13: 9780792352181
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability : Low Cost Electronics
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Electronic Packaging for High Reliability, Low Cost Electronics (Hardcover)
Published by
Kluwer Academic Publishers, Dordrecht, 2000
ISBN 10: 0792352181
ISBN 13: 9780792352181
New
Hardcover
Seller: Grand Eagle Retail, Mason, OH, U.S.A.
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Hardcover. Condition: new. Hardcover. Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The text embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. Also, the text provides a useful entry to the literature, with lists of more than 800 references covering a range of subject matter. It should have a valuable role as a source of information and ideas for research and development workers, practical nutritionists, for those engaged in education, extension and consultancy and for interested students. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9780792352181
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
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Electronic Packaging for High Reliability : Low Cost Electronics
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Electronic Packaging for High Reliability, Low Cost Electronics
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within. Seller Inventory # 5968575
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