Synopsis
This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices and technology options. The chapters are a "walk-through" of the actual assembly process. An additional chapter discusses the effect of high pin count devices (fine pitch, BGA and PGA) and their impact on the board assembly. Included is an appendix of vendors for components, sockets, material processes and equipment. Expanded coverage of water soluble paste, no clean paste and lead free solder addressses the environmental issues new to this industry.
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From the Back Cover
This standard work of reference, now in its second edition, continues to focus on educating electronic engineers in surface mount principles, mainstream industry practices, and technology options. Everything you have come to expect from the first edition plus much more is presented in this one-of-a-kind resource, exploring the basic principles and practice of Surface Mount Technology. Practicing engineers, managers, technicians, and purchasing agents involved in the manufacturing and outsourcing of electronic assemblies will find this book to be very useful in solving day-to-day design and manufacturing problems. In addition, professors and students of electrical, mechanical, manufacturing, materials, and packaging engineering will find this to be an indispensable text.
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