Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report; April 1 to June 30, 1969 (Classic Reprint) - Hardcover

W. Murray Bullis

9780331408737: Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report; April 1 to June 30, 1969 (Classic Reprint)

Hardcover

ISBN 10: 0331408732 ISBN 13: 9780331408737

Publisher: Forgotten Books, 2018

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Excerpt from Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report; April 1 to June 30, 1969

I. An improved method for grasping the wire during a pull test was developed last quarter. Since the wire is grasped with out deformation and the bond may be pulled in any direction, this convenient method, which involves the use of a quick setting hot-melt glue, permits increased control of the test conditions. It is also possible to test single bonds.

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