Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines (Hardcover)

Language: English

Published by John Wiley & Sons Inc, New York, 1994

0471594466 / 9780471594468

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Seller: CitiRetail, Stevenage, United KingdomCitiRetail

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Hardcover. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and costDefine the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic dataIdentify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failuresCharacterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involvedUse experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate.wire and wire, tape automated, and flip-chip bonding.element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate.wire and wire, tape automated, and flip-chip bonding.element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

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Title
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines (Hardcover)
Author
Michael G. Pecht
Publisher
John Wiley & Sons Inc, New York
Publication year
1994
Condition
new
Binding
Hardcover
Language
English
ISBN 10
0471594466
ISBN 13
9780471594468
Edition
1st Edition

CitiRetail

Stevenage, United Kingdom

5-star seller

AbeBooks seller since June 29, 2022

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