Condition: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,600grams, ISBN:9780412617300.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 50.43
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 324.
Seller: Revaluation Books, Exeter, United Kingdom
Paperback. Condition: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Condition: New.
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Seller: preigu, Osnabrück, Germany
Taschenbuch. Condition: Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Seller: Mispah books, Redhill, SURRE, United Kingdom
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Seller: Mispah books, Redhill, SURRE, United Kingdom
Hardcover. Condition: Very Good. Dust Jacket may NOT BE INCLUDED.CDs may be missing. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by New York, NY, U.S.A.: Chapman & Hall, 1995, 1994
ISBN 10: 0412617307 ISBN 13: 9780412617300
Seller: White Raven Books, Ypsilanti, MI, U.S.A.
Hardcover. Condition: Near Fine. 6"x9.5". Shiny yellow paper over boards; an almost fine ex library copy with no dust jacket; "This book presents a state-of-the-art review of feature techniques in CAD/CAM.The key feature modelling issues addressed are: organization, management, representation, recognition, and validation.".
Condition: As New. Unread book in perfect condition.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 187.59
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 187.58
Quantity: Over 20 available
Add to basketCondition: New.
Condition: New.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 200.59
Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
Language: English
Published by Springer Us Dez 1994, 1994
ISBN 10: 0412617307 ISBN 13: 9780412617300
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Neuware - This book provides up-to-date information about the promising use of feature technology for integrating computer-aided-design with subsequent applications. The book consists of 20 articles based upon the international IFIP conference on this topic held in Valenciennes, France in May 1994.
Springer, Wien, 1993. VIII, 309 pages with 199 figures, hard cover, (former library book)--- 736 Gramm.
Language: Chinese
Published by Northwestern Polytechnical University Press, 2000
ISBN 10: 7561230699 ISBN 13: 9787561230695
Seller: liu xing, Nanjing, JS, China
paperback. Condition: New. Paperback. Pub Date: 2011 Pages: 337 Language: Chinese in Publisher: Northwestern Polytechnical University Press colleges 12th Five-Year Plan textbook Mechanical Manufacturing and Automation Series: CAD facing the entire product lifecycle theory and technology system from the point of view for the entire life cycle of products. a combination of theory and practice. the system is a thorough introduction to the basic concepts of a CAD development history. theory. techniques. methods. systems. a.
Seller: Brook Bookstore On Demand, Napoli, NA, Italy
Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer Vienna Jan 2012, 2012
ISBN 10: 3709193176 ISBN 13: 9783709193174
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. 324 pp. Englisch.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 324 199 Figures, 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 324.
Language: English
Published by Springer Vienna, Springer Jan 2012, 2012
ISBN 10: 3709193176 ISBN 13: 9783709193174
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 324 pp. Englisch.