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Published by Springer Fachmedien Wiesbaden, 2023
ISBN 10: 365841040X ISBN 13: 9783658410407
Language: English
Seller: AHA-BUCH GmbH, Einbeck, Germany
£ 62.55
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching,doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includesmodern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view.
Published by Vieweg + Teubner Verlag, 2023
ISBN 10: 365841040X ISBN 13: 9783658410407
Language: English
Seller: Revaluation Books, Exeter, United Kingdom
Paperback. Condition: Brand New. 275 pages. 9.45x6.61x0.63 inches. In Stock.