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SiC Power Module Design : Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Condition: New.
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SiC Power Module Design
Book 64 of 65: Energy EngineeringLanguage: English
Published by Institution of Engineering and Technology, GB, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Hardback. Condition: New. High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.
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SiC Power Module Design: Performance, robustness and reliability (Energy Engineering)
Book 64 of 65: Energy EngineeringLanguage: English
Published by The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Condition: New.
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SiC Power Module Design : Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Condition: As New. Unread book in perfect condition.
-
SiC Power Module Design : Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 113.12
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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SiC Power Module Design : Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 114.62
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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SiC Power Module Design: Performance, robustness and reliability (Energy Engineering)
Book 64 of 65: Energy EngineeringLanguage: English
Published by The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 121.56
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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SiC Power Module Design
Book 64 of 65: Energy EngineeringLanguage: English
Published by Institution of Engineering and Technology, GB, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Hardback. Condition: New. High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.
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Sic Power Module Design: Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by Inst of Engineering & Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Hardcover. Condition: Brand New. 300 pages. 9.25x6.00x0.75 inches. In Stock.
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Sic Power Module Design: Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by INSTITUTION OF ENGINEERING & T, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Condition: New. KlappentextWide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packagin.
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Sic Power Module Design: Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by Institution Of Engineering & Technology Feb 2022, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Buch. Condition: Neu. Neuware - Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
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Sic Power Module Design: Performance, Robustness and Reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
HRD. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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SiC Power Module Design
Book 64 of 65: Energy EngineeringLanguage: English
Published by Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
£ 123.84
£ 5.02 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHRD. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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SiC Power Module Design: Performance, robustness and reliability
Book 64 of 65: Energy EngineeringLanguage: English
Published by Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
£ 134.13
£ 18.10 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
