Modern Electronics Assembly Technology (8 results)

Paperback. Condition: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.

Soft cover. Condition: New. Language:Chinese.Author:FAN RONG RONG.Binding:Soft cover.Publisher:Electronics Industry Publishing House Pub. Date :2.

paperback. Condition: New. Language:Chinese.Pages Number: 10227 Publisher: Electronic Industry Publishing House Pub. Date :2009-09. This book in-depth analysis of driver re-flow soldering technology development and improvement of power based on a comprehensive and systematic introduction to the re-flow characteristics of the composition of welding equipment and future development trend. but also to explore its application of research technology and content. re-flow soldering methods and quality control requirements. th.

paperback. Condition: New. Paperback. Pub Date: 2009 Pages: 284 Language: Chinese in Publisher: Publishing House of Electronics Industry. wave soldering invention and its promotion and application of the technology is the most brilliant achievements in the 20th century electronic product assembly technology. SMT reflow soldering process a large number of applications. resulting in the decline in the proportion of the wave soldering process. but the through-hole assembly in a number of electronic products still account .

paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2015-11-01 Pages: 304 Publisher: Electronic Industry Press electronics assembly processes and equipment are various electrical and mechanical equipment. tooling. fixtures. testing equipment. measuring instruments and electronic products used in the manufacturing process. etc. in general. the implementation of electronic assembly tools and instruments associated process technology. Development of process technology and equipment development process determi.

paperback. Condition: New. Paperback. Pub Date: 2015-12-01 Pages: 332 Language: Chinese Publisher: Electronic Industry Press With the development of electronic products to the multi-functional. high density. miniaturization direction of electronic linking process has undergone great changes. involving solder assembling material PCB. components and other more challenging. couplet technology and reliability of the higher requirements. therefore. an urgent need to elaborate a system of modern electronic instinct linking p.

paperback. Condition: New. Paperback. Pub Date: 2015-10-01 Pages: 332 Language: Chinese Publisher: Electronic Industry Press development of modern electronics manufacturing technology advances. electronic products faster. smaller. cheaper price requirements to promote the electronics manufacturing technology revolution. The rapid development of microelectronics technology and progress of human society with more benefits and the Gospel. but also to the modern electronics manufacturing technology has brought more problem.

paperback. Condition: New. Paperback. Pub Date: 2015-12-01 Pages: 268 Language: Chinese Publisher: Electronic Industry Press book is based on modern equipment linking principle electronic soldering technology analysis. clarifies the welding process and solution-diffusion two wet spread the main importance of the process of joint formation. typical group bonding technique (reflow. wave soldering). local welding technology (welding mask. select welding. laser welding. hot welding. etc.) and manual welding technology proc.