Order Total (1 Item Items):
Shipping Destination:
Modeling Design Electromagnetic Compatibility by Wei Xing Chang (16 results)
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (16)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
- New (13)
- As New, Fine or Near Fine (2)
- Very Good or Good (1)
- Fair or Poor (No further results match this refinement)
- As Described (No further results match this refinement)
Binding
Collectible Attributes
- First Edition (No further results match this refinement)
- Signed (No further results match this refinement)
- Dust Jacket (No further results match this refinement)
- Seller-Supplied Images (2)
- Not Print on Demand (13)
Language (1)
Free Shipping
Seller Location
Seller Rating
-
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Seller: WorldofBooks, Goring-By-Sea, WS, United Kingdom
Seller rating 5 out of 5 stars
Paperback. Condition: Very Good. The book has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
-
Condition: As New. Unread book in perfect condition.
-
-
-
-
Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
-
Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
-
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Language: English
Published by Taylor & Francis Ltd, 2020
ISBN 10: 0367573660 ISBN 13: 9780367573669
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
-
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 59.57
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
-
-
Paperback. Condition: Brand New. 340 pages. 9.21x6.14x0.87 inches. In Stock.
-
Hardcover. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
-
PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
-
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
£ 60.26
£ 5.02 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
-
Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
